Machining

Silicon is the most common material that is used to make diffraction crystals and mirrors. Machining of silicon to provide both precision crystallographic alignment and accurate dimensional control is an extremely skilled process.

The process of cutting the material to the required size and shape involves many steps. X-ray crystallography is used to confirm the crystal orientation in the silicon ingot. In order to make larger diffraction crystals it is often necessary to slice the ingot in such as way as to access crystal zones other than the main ingot axis.

Initial cutting is usually done with diamond slitting saws; milling and grinding may also be used. Other detail such as cooling holes and channels may be diamond drilled or milled. Investment in the latest diamond cutting technology ensures machining to an accuracy of 5µm.